17th International Colloquium on PLASMA PROCESSES
June 22-26, 2009 - Parc Chanot, Marseille (France)
 
 
SHORT COURSES
June, Monday 22nd and Tuesday 23rd

Some short courses will cover the basic principles of plasma physics and plasma surface interactions, some overview of plasma assisted deposition and etching processes as well as their application in microelectronics, micro-nanotechnology, biomaterials and biosensors. All lectures and discussions will be held in English.

Introduction to cold plasmas
T. Gans - Univ. Belfast, Ireland, UK
Intelligent exploitation of cold plasmas plays a key role in future technologies facing major challenges of society, such as energy and health. Important examples are nanoscale fabrication and bio-medical applications. This tutorial gives an introduction to cold plasmas and their exotic non-equilibrium properties. Cold plasmas are weakly ionized and most commonly produce in electrical discharges. The resulting multi-particle system consists of electrons, ions (positive & negative), excited particles, radicals, and neutral background gas. The power coupled into the plasma is predominantly absorbed by comparatively light electrons with resulting typical electron temperatures above 10000 K. Due to inefficient energy transfer between light electrons and heavy particles the heavy particle temperature remains close to room temperature. This exotic non-equilibrium nature of cold plasmas is the basis for many technologies exploiting the cold but highly reactive environment for treatments of temperature sensitive materials. General concepts of plasma production and sustainment will be discussed, examples include DC discharges and most commonly employed radio-frequency plasmas.

Advanced plasma diagnostics for thin film deposition: in situ studies
R. van de Sanden - Univ. Eindhoven, The Netherlands

In this tutorial I will review the complex process of plasma deposition. Plasma deposition is an example of a deposition process in which the gas is activated, i.e. the presence of reactive species (radicals, ions and excited species) is key to the understanding of the film growth process. I will review the measurement of the reactive species by means of cavity ring down spectroscopy and threshold ionization mass spectrometry in a remote plasma. Another important aspect of film growth (or etching) is the plasma-surface interaction of the reactive species, i.e. the reaction probility of a reactive specie with the film growth surface and which is in most cases unknown. Several advanced experiments to determine this reaction probability under film growth conditions will be discussed. To unravel the physical and chemical processes occuring during the plasma-surface interaction, the film surface under plasma processing conditions needs to be characterized. Novel surface diagnostics, which employ the principle of photon-in-photon-out and thus are non-intrusive in nature, such as second harmonic generation and evanescent wave cavity ring down spectroscopy, will be discussed shortly.


Plasma chemistry, plasma/surface interaction and thin film deposition in PECVD
J. Benedikt - Univ. Bochum, Germany

Low temperature plasmas are fascinating medium where electrons, ions and reactive neutral species can coexist under a steady state but non-equilibrium conditions. Selective heating of electrons by electromagnetic fields and a slow energy transfer in elastic collisions are responsible for a large difference between electron and heavy particle temperatures. Deposition of thin films from these low temperature plasmas is interplay of several mechanisms. Energetic electrons generate reactive species in ionization, dissociation and excitation collisions with “cold” molecules. Surface reactions and surface diffusion of these reactive species result in formation of a condensate on the plasma-facing surface. Ions accelerated through the sheath on the edge of the plasma bombard the surface, modify significantly film properties and bring anisotropy into the film growth. High deposition rates and excellent and unique film properties in many applications can be achieved with these so-called Plasma Enhanced CVD processes. Basic principles of plasma chemistry, plasma/surface interaction and thin film growth will be discussed and selected examples of PECVD processes at low and atmospheric pressure will be shown in this lecture.


Physical Vapour Deposition of thin films: from DC to High-Power Impulse Magnetron Sputtering
S. Konstantinidis - Univ. Mons, Belgium
Magnetron sputtering is a well established thin film growth technique. Based upon the interaction of plasma ions with the sputtering target, magnetron sputtering allows the synthesis of functional coatings that have a strong impact in technological fields such as optics, electronics, wear resistant coatings...
During this lecture, the basics of plasma - surface interactions will be described during non-reactive and reactive sputtering experiments used in the production of metal and compound coatings, respectively.
Several magnetron sputtering experiments will be presented: starting from DC sputtering then moving towards DC-pulsed sputtering to finally end with the state-of-the-Art High-Power Impulse Magnetron Sputtering technology. Advantages and drawbacks of each technique will be addressed. Throughout the lecture, the synthesis of titanium and titanium oxide films will be used in order to illustrate the different sputtering processes

Plasma etching for microelectronics and nano-microtechnology
C. Cardinaud - Univ. Nantes, France
Plasma etching is one of the basic steps used in semiconductor processing for the fabrication of electronic devices. In micro-technology this technique is also widely used to design central
parts of MEMS and MOEMS e.g. for the fabrication of sensors, actuators, photonics and microfluidics devices. Plasma etching processes are thus asked to produce patterns from the nanometre to the micrometre range and meet in each case various technological requirements, which can prove to
be severe.
The lecture will recall the basic aspects of plasma physics and chemistry that characterises plasma etching: etch rate, selectivity, profile control, surface damage… Focus will be set on the complexity of the plasma phase: how the plasma interacts with the surface, how patterning is obtained, and the role of the reactor walls. Connection will be made with the general characteristics of the most commonly used etching equipment: planar rf diode and high-density systems. Problems specifically related to the processing of features with a small opening and of high aspect ratio will be addressed.
The lecture will be illustrated through examples taken from the literature. Etching of Si and SiO_2 will be used as textbook cases, but attention will be paid to other materials of technological interest, as low-k, high-k, metals, III-Vs…
Plasma treatment of polymeric surfaces and applications to biomaterials and biosensors engineering
F. Poncin Epaillard - Univ. du Maine, Le Mans, France

After a short review on polymeric surfaces properties, illustrations of the different surface treatments applied in polymer chemistry will be given. The discussion will be focused on a comparison between the cold plasma chemistry and the more classical treatments such as chemical, abrasive ones.
The efficiency of the plasma treatment will be related to the interactions between the different reactive species of the plasma phase and the polymer surface. These interactions induce four types of reactions onto the polymer surface: first of all activation, i.e. surface radicals formation, then cross-linking, degradation and functionalization. All these reactions take place, but their rates depend on the nature of polymer surface and of the plasma phase. An attention is also pointed out on the ageing properties of the modified surface.
Bioapplications of plasma-treated surface or plasma-deposited layers will be also described. The 3 types of plasma techniques, i.e. plasma modification, plasma deposition and plasma followed by grafting reaction are used for the fabrication of tools, medical devices and biomaterials. Depending on the application, bioadhesion of cells and biomolecules is either looked for or avoided. Since the mechanisms of bioadhesion depend on the characteristics of the surface : hydrophilic or hydrophobic, acid-base …; modifying the surface by a specific treatment will alter and therefore control the bioadhesion . Illustration will be given on anti-fouling process, sterilization and improvement of the biofilms formation. We will show how the plasma chemistry is powerful for the synthesis of biomimicking devices and sensors.

   
   
 
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